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封装设计

Design & Simulation Capability

Item

Package   Design

Electrical   Simulation

Thermal   Management

Mechanical   Analysis

1

FC/WB BGA Design

Impedance matching and   control

Thermal design and   verification

Process simulation (Molding, Reflow,   etc.)

2

MCM /SiP Design

Lumped parameter   elements extraction

Thermo-electrical   co-simulation

Thermo-mechanical simulation (TC, HTS)

3

WLCSP / Fan out WLP design

S parameters   extraction

Hot spot effect   evaluation

Humidity simulation

4

PoP/PiP design

TDR analysis

Thermal resistance   extraction

Hygro-mechanical simulation

5

FPC design

SI/PI analysis

 -

Thermo-mechanical-moisture simulation (HAST, 85°C/85RH, etc.)

6

2.5D Interposer Design

EMI analysis

 -

Drop test

7

Ceramic Design

IPD simulation

 -

 -

8

IPD Design

RF/MW System   simulation

 -

 -  


高密度SiP设计方案


研究领域:

高密度SiP封装, 最高引脚数1W+;

高频器件, 封装支持最高频率100GHz以上;  

先进封装, Fanout, 2.5 Interposer,C2C键合、W2W键合 、硅基3D封装;


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FC+WB SiP样品高功率SiP样品
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硅基3D封装CIS封装Fan-out封装


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